Enabling 3D Printed O&P

Discover how 3D printing and post-processing technologies are transforming the Orthotics & Prosthetics (O&P) field in a live webinar by DyeMansion and HP.

AI-Driven Constraint Generation for PCB and IC Package Design

Join a live webinar by Cadence, which introduces the industry’s first constraint generation flow featuring AI-based optimization between Allegro X PCB and IC package implementation tools and Sigrity X Topology Workbench, a powerful system-level SI/PI environment excelling in what-if/pre-route analysis.